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SX1242
ADVANCED COMMUNICATIONS & SENSING
DATASHEET
SX1242 - Low Cost Integrated Transmitter IC 344.940 MHz RF Transmitter
GENERAL DESCRIPTION
The SX1242 is an ultra-low-cost, fully integrated standalone OOK transmitter suitable for operation at 344.940 MHz The SX1242 is designed for use without the requirement for configuration via an MCU. The SX1242 offers integrated radio performance with cost efficiency and is suited for operation in North America (FCC part 15.231).
APPLICATIONS
Low-Cost Consumer Electronic Applications Remote Keyless Entry (RKE) Remote Control / Security Systems Audio Accessories Process and building / home control
ORDERING INFORMATION
Part Number SX1242ISETRT Temperature Range -40 C to +85 C Qty. per Reel 2500 Package SOIC8-EP
KEY PRODUCT FEATURES
+12 dBm Output Power 344.940 MHz Operation OOK Bit Rates up to 10 kbps Pre-Configured Modes for Operation without MCU 1.8 to 3.7 V Supply Range Low BOM Fully Integrated TX
Pb-Free, Halogen Free, RoHS/WEEE compliant product.
GND
1 2 3 4
CP M/N
8 7 6 5
RFOUT
v v v
DATA
VDD
GND
PFD
TX ENABLE VDD
XTAL
v
SX1242, Rev 1, November 2010 (c)2010 Semtech Corp.
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SX1242
ADVANCED COMMUNICATIONS & SENSING Table of contents
Section Page
DATASHEET
1.
General Description ................................................................................................................................................. 3 1.1. 1.2. 1.3. Pin Diagram ..................................................................................................................................................... 3 Marking Diagram.............................................................................................................................................. 4 Pin Description................................................................................................................................................. 4 ESD Notice ...................................................................................................................................................... 5 Absolute Maximum Ratings ............................................................................................................................. 5 Operating Range.............................................................................................................................................. 5 Electrical Specifications ................................................................................................................................... 6
2.
Electrical Characteristics ......................................................................................................................................... 5 2.1. 2.2. 2.3. 2.4.
3. 4.
Circuit Description.................................................................................................................................................... 7 Application Information ............................................................................................................................................ 9 4.1. 4.2. 4.3. 4.4. Crystal Specification ........................................................................................................................................ 9 Reference Design Schematic .......................................................................................................................... 9 Reference Design PCB Layout ......................................................................................................................10 Reference Design BOM .................................................................................................................................10 Package Outline Drawing .............................................................................................................................. 11 Land Pattern .................................................................................................................................................. 11 Thermal Impedance ....................................................................................................................................... 12 Tape & Reel Specification.............................................................................................................................. 12
5.
Packaging Information ........................................................................................................................................... 11 5.1. 5.2. 5.3. 5.4.
6.
Revision History..................................................................................................................................................... 13
SX1242, Rev 1, November 2010 (c)2010 Semtech Corp.
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SX1242
Integrated Transmitter IC
ADVANCED COMMUNICATIONS & SENSING
This product datasheet contains a detailed description of the SX1242 performance and functionality.
DATASHEET
1. General Description
The SX1242 is a fully-integrated multi-band, single chip transmitter IC capable of OOK modulation of an input data stream. The SX1242 is configured, by default, to operate without a microcontroller at a pre-configured RF setting of 344.940 MHz. Another key feature of the SX1242 is its low current consumption in transmit and sleep modes and its wide voltage operating range from 1.8 V to 3.7 V. This makes the SX1242 suitable for low-cost battery chemistries or energy harvesting applications. The internal architecture of the SX1242 is shown in Figure 1. The SX1242 comprises a low-consumption PLL and power amplifier. OOK Modulation is performed via ramping of the PA reference DAC. The SX1242 is designed for use with a variety of low-cost antenna technologies including PCB-etched loop or electricallyshort stub. Further application information may be found in Section 4.
1.1. Pin Diagram
GND
1 2 0 3 4
Figure 1. Pinouts, Top View
8 7 6 5
RFOUT
DATA
VDD
GND
TX ENABLE
XTAL
VDD
SX1242, Rev 1, November 2010 (c)2010 Semtech Corp.
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SX1242
Integrated Transmitter IC
ADVANCED COMMUNICATIONS & SENSING
1.2. Marking Diagram
DATASHEET
SX1242 yyww xxxxx
Figure 2. Marking Diagram
Notes: yyww refers to the date code xxxxx refers to lot numbers
1.3. Pin Description
Table 1 SX1242 Pinout Description
Number 0 1 2 3 4 5 6 7 8 Name GND GND DATA GND XTAL VDD TX ENABLE VDD RFOUT Type I I I I I/O I I I O Function Exposed Pad, Ground Ground Transmit Data Ground Reference Crystal Power Supply, 1.8 V to 3.7 V Control PIn for Transmitter Power Supply, 1.8 V to 3.7 V Transmitter RF Output
SX1242, Rev 1, November 2010 (c)2010 Semtech Corp.
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SX1242
Integrated Transmitter IC
ADVANCED COMMUNICATIONS & SENSING
DATASHEET
2. Electrical Characteristics
2.1. ESD Notice
The SX1242 is a high performance radio frequency device, and satisfies Class 2 of the JEDEC standard JESD22-A114-B (human body model) on all pins. It should thus be handled with all necessary ESD precautions to avoid any permanent damage.
2.2. Absolute Maximum Ratings
Stresses above the values listed below may cause permanent device failure. Exposure to absolute maximum ratings for extended periods may affect device reliability.
Table 2
Absolute Maximum Ratings
Symbol Description Supply Voltage Temperature Junction Temperature Storage Temperature Min -0.5 -55 -55 -55 Max 3.9 +115 +125 150 Unit V C C C
VDDmr Tmr Tjunc Tstor
2.3. Operating Range
Operating ranges define the limits for functional operation and the parametric characteristics of the device as described in this section. Functionality outside these limits is not implied.
Table 3
Operating Range
Symbol Description Supply voltage Operational temperature range Load capacitance on digital ports Min 1.8 -40 Max 3.7 85 25 Unit V C pF
VDDop Top Clop
SX1242, Rev 1, November 2010 (c)2010 Semtech Corp.
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SX1242
Integrated Transmitter IC
ADVANCED COMMUNICATIONS & SENSING
2.4. Electrical Specifications
The table below gives the electrical specifications of the transmitter under the following conditions: Supply voltage = 3.3 V, temperature = 25 C, fXOSC = 26 MHz, fRF = 344.94 MHz, bit rate = 5 kbit/s and output power = +12 dBm terminated in a matched 50 ohm impedance, unless otherwise specified.
DATASHEET
Table 4
Symbol
Transmitter Specifications
Description Conditions Min Typ Max Unit
Current Consumption IDDSL IDDT Supply current in sleep mode Supply current in transmit mode with appropriate external matching. Logic "1" or "Mark" frequency transmitted* 0.5 22 1 A mA
RF and Baseband Specifications BRO OOK_B RFOP DRFOPV PHN FCN FXOSC DFXOSC Bit rate, OOK OOK modulation depth RF output power into 50 ohms Variation in RF output power with supply voltage Transmitter phase noise Carrier frequency Crystal Oscillator Frequency Frequency Variation of the Oscillator Circuit No crystal contribution Optimized matching network 2.5 V to 3.3 V 1.8 V to 3.7 V 100 kHz Offset from carrier Permissible range 0.5 9 26 50 12 344.94 26 10 3 7 -76 26 +/-25 kbps dB dBm dB dB dBc/Hz MHz MHz ppm
Timing Specifications TS_TR RAMP Time from Sleep to Tx mode PA Ramp up and down time** 20 2 ms us
* **
Logic "1" transmission indicated by transmission of carrier frequency at power level RFOP. Ramp-up time of the internal regulator turning the PA on. The typical 10% - 90% power ramp-up time is 10us
SX1242, Rev 1, November 2010 (c)2010 Semtech Corp.
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SX1242
Integrated Transmitter IC
ADVANCED COMMUNICATIONS & SENSING
DATASHEET
3. Circuit Description
The SX1242 compromises a low-consumption fractional-N Sigma-Delta type PLL and power amplifier. A simplified block diagram of the internal architecture and application schematic is illustrated below in Figure 3
GND
1 2 3 4
CP M/N
8 7 6 5
RFOUT
v v v
DATA
VDD
GND
PFD
TX ENABLE VDD
XTAL
v
Figure 3. SX1242 Simplified Block Diagram and Application Schematic
3.1. PLL
The VCO operates at twice the RF channel frequency and is derived from a 26 MHz crystal oscillator reference
3.2. Transmitter
The Power Amplifier (PA) is connected to the RFOUT pin and delivers 12 dBm in a 50 ohm load. The bit stream to be transmitted over the air is sent to the chip via the pin DATA. During modulation, the rising and falling transitions are smoothed with a ramp-up/ramp-down time of typically 20 s via the PA reference DAC.
3.3. SX1242 Operating Modes
The SX1242 operating modes are defined by the status of the pin TX ENABLE and are documented in Table 5.
SX1242, Rev 1, November 2010 (c)2010 Semtech Corp.
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SX1242
Integrated Transmitter IC
ADVANCED COMMUNICATIONS & SENSING
Table 5 SX1242 Operating Modes
TX Enable Status 0 (GND) 1 (VDD) Mode Sleep Transmit Enabled Blocks All blocks are off The blocks are switched on according to a predefined sequence and the data is transmitted once the sequence is completed
DATASHEET
The behavior of the SX1242 is illustrated in the timing diagram below:
TS_TR DATA RFOUT TX ENABLE TRANSMIT SLEEP
Figure 4. SX1242 Timing Diagram(Not to scale)
SX1242, Rev 1, November 2010 (c)2010 Semtech Corp.
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SX1242
Integrated Transmitter IC
ADVANCED COMMUNICATIONS & SENSING
DATASHEET
4. Application Information
4.1. Crystal Specification
The SX1242 is designed to operate with a low-cost 26 MHz crystal. The recommended crystal specification is tabulated below in Table 6.
Table 6
SX1242 Quartz Crystal Reference Oscillator Specification
Description Crystal Frequency Crystal Motional Inductance Crystal Motional Capacitance Crystal Serial Resistance Crystal Shunt Capacitance Load Capacitance Conditions Min 26 Typ 26 12.655 2.962 20 1.0 15 Max 26 100 7.0 Unit MHz mH fF Ohms pF pF
Symbol FXOSC LM CM RS C0 CL
4.2. Reference Design Schematic
C11 POD_INI 1 2 3 TX EN DATA NC VDD GND NC 8 7 6
C5
C6
4 NC
NC 5 1 2 3
U1 SX1242 8 GND RFOUT DATA GND VDD 7 TX EN 6 L1
L2 C3 C4
L3 C12 C8
4 XTAL C2 Q1
VDD 5 C7 VDD
C10
Figure 5. Application Module Schematic
SX1242, Rev 1, November 2010 (c)2010 Semtech Corp. Page 9
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SX1242
Integrated Transmitter IC
ADVANCED COMMUNICATIONS & SENSING
4.3. Reference Design PCB Layout
The SX1242 reference design PCB layout is illustrated below:
DATASHEET
Figure 6. Reference Design PCB Layout
4.4. Reference Design BOM
The following table summarizes the reference design BOM:
Table 7
Reference Design BOM
MPN SX1242ISETRT LQG15- or equivalent LQG15- or equivalent LQG15- or equivalent Pa ckage SO8 HC49 0402 0402 0402 0402 0402 0402 0402 0402 0402 0402 0402 0402 0402 Va lue SX1242 26 MHz 100pF 12pF 100nF 100pF 4.7pF 12pF 2.2pF 100nF 1uF Zero ohm 120nH 39nH 22n Qty 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 De scription RF transmitter IC Crystal 26 MHz CL=15 pF Capacitor NPO (+/-5% ) Capacitor NPO (+/-5% ) Capacitor X7R (+/-5% ) Capacitor NPO (+/-5% ) Capacitor NPO (+/-0.25pF) Capacitor NPO (+/-5% ) Capacitor NPO (+/-0.25pF) Capacitor X7R (+/-5% ) Capacitor X5R (+/-5% ) Resistor Zero Ohm Multilayer chip inductor (+/-5% ) Multilayer chip inductor (+/-5% ) Multilayer chip inductor (+/-5% )
Re fDe s U1 Q1 C3 C4 C5 C6 C7 C8 C9 C10 C11 C12 L1 L2 L3
SX1242, Rev 1, November 2010 (c)2010 Semtech Corp.
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SX1242
Integrated Transmitter IC
ADVANCED COMMUNICATIONS & SENSING
DATASHEET
5. Packaging Information
The SX1242 is delivered in an SOIC package with 8 leads and an exposed pad. See details below.
5.1. Package Outline Drawing
A N 2X E/2 E1 E 1 ccc C 2X N/2 TIPS 2 e/2 B D aaa C SEATING PLANE A2 A C bxN bbb F EXPOSED PAD H H GAGE PLANE 0.25 L (L1) c A1 C A-B D h e D
DIM
A A1 A2 b c D E1 E e F H h L L1 N 01 aaa bbb ccc
DIMENSIONS INCHES MILLIMETERS MIN NOM MAX MIN NOM MAX
.053 .069 .000 .005 .049 .065 .012 .020 .007 .010 .189 .193 .197 .150 .154 .157 .236 BSC .050 BSC .086 .130 .085 .099 .010 .020 .016 .028 .041 (.041) 8 0 8 .004 .010 .008 1.75 1.35 0.00 0.13 1.25 1.65 0.31 0.51 0.17 0.25 4.80 4.90 5.00 3.80 3.90 4.00 6.00 BSC 1.27 BSC 2.19 3.30 2.15 2.51 0.25 0.50 0.40 0.72 1.04 (1.05) 8 0 8 0.10 0.25 0.20
h
01
SEE DETAIL SIDE VIEW
NOTES: 1.
A
DETAIL
A
CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).
2. DATUMS -A- AND -B- TO BE DETERMINED AT DATUM PLANE -H3. DIMENSIONS "E1" AND "D" DO NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
Figure 7. Package Outline Drawing
5.2. Land Pattern
E D SOLDER MASK
DIM
(C) F G Z C D E F G P X Y Z
DIMENSIONS INCHES MILLIMETERS
(.205) .134 .201 .101 .118 .050 .024 .087 .291 (5.20) 3.40 5.10 2.56 3.00 1.27 0.60 2.20 7.40
Y THERMAL VIA O 0.36mm P X
NOTES: 1. 2. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY. CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR COMPANY'S MANUFACTURING GUIDELINES ARE MET.
3. REFERENCE IPC-SM-782A, RLP NO. 300A. 4. THERMAL VIAS IN THE LAND PATTERN OF THE EXPOSED PAD SHALL BE CONNECTED TO A SYSTEM GROUND PLANE. FAILURE TO DO SO MAY COMPROMISE THE THERMAL AND/OR FUNCTIONAL PERFORMANCE OF THE DEVICE.
Figure 8. Land Pattern
SX1242, Rev 1, November 2010 (c)2010 Semtech Corp.
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SX1242
Integrated Transmitter IC
ADVANCED COMMUNICATIONS & SENSING
5.3. Thermal Impedance
The thermal impedance of this package is: Theta ja = 36 C/W typ., calculated from a package in still air, on a 4-layer FR4 PCB, as per the Jedec standard.
DATASHEET
5.4. Tape & Reel Specification
Carrier Tape Tape Width (W) 12 +/-0.30 Pocket Pitch (P) 8 +/-0.10 Ao / Bo 6.5 / 5.4 +/-0.30 Ko 2.00 +/-0.15 Reel Size 330.2
Reel Reel Width 12.4 Min. Trailer Length 400 Min. Leader Length 400 QTY per 2500 Unit mm
Figure 9. Tape & Reel Specification
Note Single Sprocket Holes
SX1242, Rev 1, November 2010 (c)2010 Semtech Corp.
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SX1242
Integrated Transmitter IC
ADVANCED COMMUNICATIONS & SENSING
DATASHEET
6. Revision History
Table 8 Revision History
Comment Revision Date 1 November 2010 First FINAL datasheet version
SX1242, Rev 1, November 2010 (c)2010 Semtech Corp.
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SX1242
ADVANCED COMMUNICATIONS & SENSING
DATASHEET
(c) Semtech 2010 All rights reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent or other industrial or intellectual property rights. Semtech assumes no responsibility or liability whatsoever for any failure or unexpected operation resulting from misuse, neglect improper installation, repair or improper handling or unusual physical or electrical stress including, but not limited to, exposure to parameters beyond the specified maximum ratings or operation outside the specified range. SEMTECH PRODUCTS ARE NOT DESIGNED, INTENDED, AUTHORIZED OR WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT APPLICATIONS, DEVICES OR SYSTEMS OR OTHER CRITICAL APPLICATIONS. INCLUSION OF SEMTECH PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TO BE UNDERTAKEN SOLELY AT THE CUSTOMER'S OWN RISK. Should a customer purchase or use Semtech products for any such unauthorized application, the customer shall indemnify and hold Semtech and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs damages and attorney fees which could arise.
Contact information
Semtech Corporation Advanced Communications & Sensing Products
E-mail: sales@semtech.comacsupport@semtech.comInternet: http://www.semtech.com USA 200 Flynn Road, Camarillo, CA 93012-8790. Tel: +1 805 498 2111 Fax: +1 805 498 3804 12F, No. 89 Sec. 5, Nanking E. Road, Taipei, 105, TWN, R.O.C. Tel: +886 2 2748 3380 Fax: +886 2 2748 3390 Semtech Ltd., Units 2 & 3, Park Court, Premier Way, Abbey Park Industrial Estate, Romsey, Hampshire, SO51 9DN. Tel: +44 (0)1794 527 600 Fax: +44 (0)1794 527 601
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